As an industry leader in Circuit Card Assembly, SED uses both surface mount technology (SMT) and through-hole technology (THT). We produce complex multi-layer circuit cards for a wide range of applications, from digital signal processing to high current power management.
We are fully capable of producing boards to IPC-A-610 class 3 for the most demanding military applications. Our board production cell supports both our own products as well as clients on a contract basis.
Our PCB capabilities include:
- State of the art SMT line capable of placing 01005 components (0.01” x 0.005”) with 3D optical, and available X-ray inspection
- Support both lead-free and traditional lead components
- Automated board test
- Selective solder line for through-hole components