Circuit Card Assembly

LAN Manufacturing

Using both surface mount (SMT) and through-hole technologies we produce complex multi layer cards for a wide range applications from digital signal processing to high current power management. We are fully capable of producing boards to IPC-A-610 class 3 for the most demanding military applications. Our board production cell supports both our own products as well as clients on a contract basis. Our capabilities include:

  • State of the art SMT line capable of placing 01005 components (0.01” x 0.005”) with 3D optical, and available X-ray inspection
  • Support both lead free and traditional lead components
  • Automated board test
  • Selective solder line for through-hole components

Surface Mount Line